Automotive-Grade Molded Power Inductors for Advanced Power Applications

Latest inductor innovations featuring high current capability, low DCR, and robust construction for power converters and thermal-efficient designs

2025Q4 E-Newsletter LTCC New Products For Bluetooth Applications

Excited to share our latest e-newsletter featuring new LTCC RF components designed for Bluetooth applications. These compact, high-performance solutions offer excellent RF stability and reliable performance to support Bluetooth and other short-range wireless designs. Our latest LTCC products include several band pass filter and low-pass filters in various sizes while meeting demanding performance requirements. Follow ABC to learn more and stay updated on our newest innovations.


16 Dec, 2025
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2025 Automotive Grade Product Catalog

How can you reduce power converter losses while maintaining compact design in next-generation automotive power management systems?

ABC ATEC's molded power inductors (AGA, AGC, AMV, AMT series) deliver high current capability with low DCR specifically designed for automotive power converters. The robust molded construction ensures mechanical reliability while optimizing thermal performance in space-constrained applications. Our IATF16949 certified manufacturing and 45 years of inductor expertise guarantee the quality and performance your automotive designs demand. Request technical specifications and samples today to integrate these advanced inductors into your power management solutions.

With 45 years of specialized expertise in inductor design and manufacturing, ABC ATEC brings IATF16949 Quality Certification and proprietary production technologies to every molded power inductor solution. These latest series are engineered to support your next design with proven performance, customization flexibility, and the quality standards demanded by automotive, industrial control, telecommunications, medical, and consumer electronics sectors. Contact ABC ATEC to explore how these molded power inductors can optimize efficiency, reduce thermal challenges, and accelerate your product development timeline.