10nH, 220mA, 0603 RF Inductor, Multilayer Chip Inductor
MH060310NJS
Multilayer Chip Inductor, General Grade
10nH, 220mA, 0603 Multilayer Chip Inductor MH series are compact, low-profile components with high self resonant frequency (SRF) and ceramic body can withstand operating temperature from -55°C to +125°C. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.
Product Features
- Multilayer structure
- Operating temp.: -55°C ~ +125°C (including self-temperature rise)
Product Applications
- Smart phones, personal devices
- High frequency circuits
| Product Category | RF Inductor - Multilayer Chip Inductor | Inductance (µH) | 0.01 |
| Part Number | MH060310NJS | Tolerance | ±5% |
| Grade | General | RDC (Ω) | 0.51 |
| Length (mm) | 0.6 | IDC (A) | 0.22 |
| Width (mm) | 0.3 | Operating temp.°C (LOW) | -55 |
| Height (mm) | 0.3 | Operating temp.°C (HIGH) | 125 |
- Download
Multilayer Chip Inductor MH0603 Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you source reliable multilayer RF inductors that meet compact form factor requirements while maintaining high-frequency performance in next-generation smartphone designs?
ABC ATEC's MH060310NJS multilayer chip inductor delivers the compact 0603 footprint and high self-resonant frequency your smartphone RF circuits demand. With proven IATF16949 certification and 45 years of manufacturing expertise, we ensure consistent performance across production volumes. Our specialized RF inductor solutions are engineered specifically for high-frequency smartphone applications, enabling you to achieve superior signal integrity while maintaining minimal PCB real estate. Request a technical datasheet and sample evaluation to validate performance in your designs.
Manufactured under IATF16949 quality certification standards, the MH060310NJS represents ABC ATEC's 45 years of specialized expertise in inductor design and manufacturing. This compact, low-profile component integrates seamlessly into advanced PCB layouts while delivering the high-frequency performance demanded by today's wireless communication devices. Whether optimizing RF front-end circuits in flagship smartphones or engineering next-generation personal devices, this multilayer chip inductor provides the precision, reliability, and miniaturization your applications require. Contact ABC ATEC's technical team to explore customization options and discover how our RF inductor solutions can enhance your product performance and accelerate your time-to-market.




