9.1nH, 220mA, 0603 RF Inductor, Multilayer Chip Inductor
MH06039N1JS
Multilayer Chip Inductor, General Grade
9.1nH, 220mA, 0603 Multilayer Chip Inductor MH series are compact, low-profile components with high self resonant frequency (SRF) and ceramic body can withstand operating temperature from -55°C to +125°C. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.
Product Features
- Multilayer structure
- Operating temp.: -55°C ~ +125°C (including self-temperature rise)
Product Applications
- Smart phones, personal devices
- High frequency circuits
| Product Category | RF Inductor - Multilayer Chip Inductor | Inductance (µH) | 0.0091 |
| Part Number | MH06039N1JS | Tolerance | ±5% |
| Grade | General | RDC (Ω) | 0.48 |
| Length (mm) | 0.6 | IDC (A) | 0.22 |
| Width (mm) | 0.3 | Operating temp.°C (LOW) | -55 |
| Height (mm) | 0.3 | Operating temp.°C (HIGH) | 125 |
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Multilayer Chip Inductor MH0603 Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you reduce PCB footprint while maintaining RF signal integrity in next-generation smartphone designs?
ABC ATEC's MH06039N1JS multilayer chip inductor delivers industry-leading performance in a compact 0603 package with high SRF capability. Our ceramic multilayer construction ensures superior signal fidelity for RF circuits while minimizing board space requirements. Contact our technical team to discuss customized inductor solutions tailored to your smartphone's specific RF architecture and miniaturization goals.
The MH06039N1JS operates across an extended temperature range from -55°C to +125°C, including self-temperature rise effects, ensuring stable performance in diverse environmental conditions. Leveraging ABC ATEC's 45 years of specialized expertise in inductor design and manufacturing, combined with our IATF16949 Quality Certification, this RF inductor represents our commitment to delivering customized solutions with proprietary production technologies. Perfect for OEM manufacturers seeking compact, high-performance inductive components, our multilayer chip inductor solution provides the reliability and precision engineering required for next-generation consumer electronics and telecommunications equipment.



