1.6nH, 400mA, 1005 RF Inductor, Multilayer Chip Inductor
MH10051N6DL
Multilayer Chip Inductor, General Grade
1.6nH, 400mA, 1005 Multilayer Chip Inductor MH series are compact, low-profile components with high self resonant frequency (SRF) and ceramic body can withstand operating temperature from -55°C to +125°C. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.
Product Features
- Multilayer structure
- Operating temp.: -55°C ~ +125°C (including self-temperature rise)
Product Applications
- Smart phones, personal devices
- High frequency circuits
| Product Category | RF Inductor - Multilayer Chip Inductor | Inductance (µH) | 0.0016 |
| Part Number | MH10051N6DL | Tolerance | ±0.3nH |
| Grade | General | RDC (Ω) | 0.1 |
| Length (mm) | 1 | IDC (A) | 0.4 |
| Width (mm) | 0.5 | Operating temp.°C (LOW) | -55 |
| Height (mm) | 0.5 | Operating temp.°C (HIGH) | 125 |
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Multilayer Chip Inductor MH1005 Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you miniaturize RF circuits while maintaining signal integrity and thermal stability in next-generation smartphone designs?
ABC ATEC's MH10051N6DL multilayer chip inductor delivers exceptional self-resonant frequency and compact 1005 form factor, enabling space-efficient RF front-end designs without performance compromise. Our IATF16949 certified manufacturing ensures batch-to-batch consistency with ±0.3nH tolerance, meeting the stringent quality requirements of leading smartphone manufacturers. Explore how our 45 years of inductor expertise can optimize your RF circuit performance and reduce PCB footprint.
ABC ATEC's 45 years of specialized expertise in inductor design and manufacturing is reflected in this RF inductor's precision tolerance of ±0.3nH, ensuring consistent performance across production batches. As an IATF16949 certified manufacturer, we apply rigorous quality control standards to every component, delivering the reliability that leading smartphone manufacturers and high-frequency circuit designers demand. Whether you're developing next-generation wireless devices, optimizing RF front-end modules, or designing compact personal electronics, our MH10051N6DL multilayer chip inductor provides the performance, miniaturization, and thermal stability required for mission-critical applications. Contact our engineering team today to explore customization options or integrate this high-performance RF inductor into your product development roadmap.


