Professional RF Inductor Solutions for High-Frequency Applications

Compact 5.6nH Multilayer Chip Inductor with High Self-Resonant Frequency and Wide Operating Temperature Range

5.6nH, 400mA, 1005 RF Inductor, Multilayer Chip Inductor - High Frequncy Multilayer Chip Inductor
  • 5.6nH, 400mA, 1005 RF Inductor, Multilayer Chip Inductor - High Frequncy Multilayer Chip Inductor

5.6nH, 400mA, 1005 RF Inductor, Multilayer Chip Inductor

MH10055N6DL

Multilayer Chip Inductor, General Grade

5.6nH, 400mA, 1005 Multilayer Chip Inductor MH series are compact, low-profile components with high self resonant frequency (SRF) and ceramic body can withstand operating temperature from -55°C to +125°C. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.

Product Features
  • Multilayer structure
  • Operating temp.: -55°C ~ +125°C (including self-temperature rise)
Product Applications
  • Smart phones, personal devices
  • High frequency circuits
Product CategoryRF Inductor - Multilayer Chip InductorInductance (µH)0.0056
Part NumberMH10055N6DLTolerance±0.3nH
GradeGeneralRDC (Ω)0.2
Length (mm)1IDC (A)0.4
Width (mm)0.5Operating temp.°C (LOW)-55
Height (mm)0.5Operating temp.°C (HIGH)125
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Multilayer Chip Inductor MH1005 Series Datasheet
Multilayer Chip Inductor MH1005 Series Datasheet

Include dimensions, electrical characteristics and curve diagrams for your reference

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How can you reduce component size while maintaining RF performance in next-generation smartphone designs?

ABC ATEC's MH10055N6DL multilayer chip inductor delivers high self-resonant frequency in an ultra-compact 1005 package, enabling you to optimize PCB real estate without compromising signal integrity. Our 45 years of inductor expertise and IATF16949 certification ensure consistent quality for high-volume smartphone production. Request a technical consultation to discuss how our RF inductors can streamline your design and reduce time-to-market.

ABC ATEC leverages 45 years of specialized expertise in inductor design and manufacturing, combined with IATF16949 Quality Certification, to deliver components that meet the stringent requirements of leading consumer electronics manufacturers. The ceramic body construction of this RF inductor provides excellent thermal stability and mechanical robustness, while the compact form factor enables seamless integration into high-density PCB layouts. Whether you're developing next-generation smartphones, portable communication devices, or advanced RF modules, our multilayer chip inductors provide the reliability, precision, and performance your products demand. Contact ABC ATEC today to explore customized inductor solutions tailored to your specific application requirements and volume needs.