150nH RF Inductor 1608 | ABC ATEC Multilayer Chip
ABC ATEC's 150nH, 250mA multilayer chip inductor (MH1608R15JL) features high SRF and ceramic body for smartphones and high frequency circuits. -55°C to +125°C operating range.
150nH, 250mA, 1608 RF Inductor, Multilayer Chip Inductor
MH1608R15JL
Multilayer Chip Inductor, General Grade
150nH, 250mA, 1608 Multilayer Chip Inductor MH series are compact, low-profile components with high self resonant frequency (SRF) and ceramic body can withstand operating temperature from -55°C to +125°C. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.
Product Features
- Multilayer structure
- Operating temp.: -55°C ~ +125°C (including self-temperature rise)
Product Applications
- Smart phones, personal devices
- High frequency circuits
| Product Category | RF Inductor - Multilayer Chip Inductor | Inductance (µH) | 0.15 |
| Part Number | MH1608R15JL | Tolerance | ±5% |
| Grade | General | RDC (Ω) | 1.7 |
| Length (mm) | 1.6 | IDC (A) | 0.25 |
| Width (mm) | 0.8 | Operating temp.°C (LOW) | -55 |
| Height (mm) | 0.8 | Operating temp.°C (HIGH) | 125 |
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Multilayer Chip Inductor MH1608 Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you achieve optimal RF signal integrity in next-generation smartphone designs while maintaining compact PCB layouts?
ABC ATEC's 150nH multilayer chip inductor delivers high self-resonant frequency performance in a compact 1608 package, enabling superior RF circuit tuning for 5G and advanced wireless connectivity. Our IATF16949-certified components ensure consistent quality across high-volume production, reducing design iterations and accelerating time-to-market. Request technical specifications and sample quantities for your smartphone RF front-end design optimization.
Drawing on ABC ATEC's 45 years of specialized expertise in inductor design and manufacturing, this RF inductor represents our commitment to delivering high-quality, customized solutions backed by IATF16949 Quality Certification. The compact low-profile design enables space-constrained PCB layouts while maintaining superior electrical performance. Whether you're optimizing smartphone RF front-end circuits, designing personal wearable devices, or developing high-frequency communication systems, our multilayer chip inductor provides the reliability and performance your applications demand. Contact our engineering team today to discuss your specific RF inductor requirements and explore customization options for your production needs.