4.7µH, 700mA, 2012 RF Inductor, Multilayer Chip Inductor
MP20124R7MP
Multilayer Chip Inductor, General Grade
4.7µH, 700mA, 2012 Multilayer Chip Inductor MP series are compact, low-profile components. Consists of ferrite material offer higher inductance and current range with low DCR. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.
Product Features
- Low DCR
- High Current
- Operating temp.: -55°C ~ +105°C (including self-temperature rise)
Product Applications
- Personal devices
- DC / DC converters
| Product Category | RF Inductor - Multilayer Chip Inductor | Inductance (µH) | 4.7 |
| Part Number | MP20124R7MP | Tolerance | ±20% |
| Grade | General | RDC (Ω) | 0.28 |
| Length (mm) | 2 | IDC (A) | 0.7 |
| Width (mm) | 1.25 | Operating temp.°C (LOW) | -55 |
| Height (mm) | 1 | Operating temp.°C (HIGH) | 105 |
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Multilayer Chip Inductor MP2012 Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you reduce PCB space while maintaining power efficiency in next-generation smartphone designs?
ABC ATEC's 4.7µH multilayer chip inductor delivers high current capacity (700mA) with exceptionally low DCR (0.28Ω) in a compact 2012 package, enabling efficient DC/DC converter designs that minimize board area without sacrificing performance. Our IATF16949 certified components ensure consistent quality for high-volume smartphone production. Let our technical experts help optimize your power management architecture.
ABC ATEC leverages 45 years of specialized expertise in inductor manufacturing to deliver this high-performance component with IATF16949 Quality Certification. The MP series multilayer chip inductor combines patented production technologies with rigorous quality standards to ensure consistent performance and reliability in your portable device designs. Whether you're developing next-generation smartphones or compact personal electronics, this low-profile inductor provides the precision engineering and customization capability you need to optimize power management circuits while maintaining compact form factors. Contact our technical team to explore customization options and volume pricing for your specific application requirements.



