47nH, 210mA, 0402 RF Inductor, Ceramic Wire Wound Chip Inductor
SWI0402CT47N
RF Ceramic Wire Wound Chip Inductor, General Grade
47nH, 210mA, 0402 RF Ceramic Wire Wound Chip Inductor SWI CT series with minimum tolerance 2% available, advance in higher self resonate frequency (SRF), high Q factor, and is widely used in the co mmunication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices.
Product Features
- Higher Self Resonate Frequency (SRF)
- High Q factor
- Tight tolerance ± 0.2nH and 2% available
- Operating temp.: -40°C ~ +125°C (including self-temperature rise)
Product Applications
- Metaverse application
- RF circuits
| Product Category | RF Inductor - Ceramic Wire Wound Chip Inductor | Inductance (µH) | 0.047 |
| Part Number | SWI0402CT47N | Tolerance | ±2% |
| Grade | General | RDC (Ω) | 0.83 |
| Length (mm) | 1 | IDC (A) | 0.21 |
| Width (mm) | 0.55 | Operating temp.°C (LOW) | -40 |
| Height (mm) | 0.5 | Operating temp.°C (HIGH) | 125 |
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RF Ceramic Wire Wound Chip Inductor SWI0402CT Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you ensure optimal RF circuit performance while maintaining strict component tolerance specifications in high-volume production?
ABC ATEC's 47nH RF ceramic chip inductor offers ±2% tolerance with tight ±0.2nH specifications and superior Q factor performance, ensuring consistent RF circuit behavior across your entire production run. Our IATF16949-certified manufacturing processes and 45 years of inductor expertise guarantee reliable, repeatable performance that reduces design iterations and accelerates time-to-market for your communication equipment.
As a manufacturer with 45 years of specialized expertise in inductor design and manufacturing, ABC ATEC delivers this RF ceramic chip inductor backed by IATF16949 Quality Certification, ensuring the highest product standards and reliability for mission-critical applications. The advanced ceramic wire wound construction provides enhanced performance stability, reduced parasitic effects, and superior frequency response characteristics essential for modern RF circuit implementations. Whether you're developing next-generation communication devices or upgrading existing designs, our customizable solutions and proprietary production technologies ensure optimal performance, cost efficiency, and seamless integration into your RF circuit architectures.



