11nH, 1350mA, 0603 RF Inductor, Ceramic Wire Wound Chip Inductor
SWI0603HP11N
RF Ceramic Wire Wound Chip Inductor, General Grade
11nH, 1350mA, 0603 RF Ceramic Wire Wound Chip Inductor SWI HP series compared to other SWI series has a larger current range and minimum tolerance 2% available, advance in higher self resonate frequency (SRF), high Q factor, and is widely used in the co mmunication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices.
Product Features
- Higher Self Resonate Frequency (SRF)
- High Q factor
- High Current
- Tight tolerance ± 0.2nH and 2% available
- Operating temp.: -40°C ~ +125°C (including self-temperature rise)
Product Applications
- Metaverse application
- RF circuits
| Product Category | RF Inductor - Ceramic Wire Wound Chip Inductor | Inductance (µH) | 0.011 |
| Part Number | SWI0603HP11N | Tolerance | ±2% |
| Grade | General | RDC (Ω) | 0.06 |
| Length (mm) | 1.8 | IDC (A) | 1.35 |
| Width (mm) | 1.12 | Operating temp.°C (LOW) | -40 |
| Height (mm) | 1.02 | Operating temp.°C (HIGH) | 125 |
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RF Ceramic Wire Wound Chip Inductor SWI0603HP Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you achieve superior RF circuit performance with minimal signal loss in compact 0603 packages for cellular and wireless applications?
ABC ATEC's 11nH RF ceramic wire wound chip inductor delivers exceptional Q factor and self-resonant frequency performance specifically engineered for communication equipment. With tight tolerance specifications (±2% available) and 1350mA current capacity, this inductor ensures optimal signal integrity and efficiency in cellular phones, cable modems, ADSL systems, and Bluetooth devices. Our 45 years of inductor manufacturing expertise and IATF16949 certification guarantee the reliability your high-volume production demands. Request technical specifications and volume pricing today.
ABC ATEC's commitment to quality excellence is reflected in this inductor's IATF16949 certification and proprietary ceramic wire wound manufacturing technology. The high Q factor and elevated self-resonant frequency characteristics ensure minimal signal loss and maximum efficiency in RF applications, while the compact 0603 form factor enables seamless integration into space-constrained PCB designs. Whether you're developing next-generation communication devices or metaverse-enabled electronics, this RF ceramic chip inductor provides the precision engineering and reliability your applications demand. Contact our team today to explore customization options and technical support for your specific RF circuit requirements.


