8.2nH RF Inductor | ABC ATEC Ceramic Wire Wound
ABC ATEC's 8.2nH RF ceramic wire wound chip inductor features high Q factor, superior SRF, and tight tolerance for cellular, Bluetooth, and communication applications.
8.2nH, 1000mA, 1008 RF Inductor, Ceramic Wire Wound Chip Inductor
SWI1008CT8N2
RF Ceramic Wire Wound Chip Inductor, General Grade
8.2nH, 1000mA, 1008 RF Ceramic Wire Wound Chip Inductor SWI CT series with minimum tolerance 2% available, advance in higher self resonate frequency (SRF), high Q factor, and is widely used in the co mmunication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices.
Product Features
- Higher Self Resonate Frequency (SRF)
- High Q factor
- Tight tolerance ± 0.2nH
- Operating temp.: -40°C ~ +125°C (including self-temperature rise)
Product Applications
- Metaverse application
- RF circuits
| Product Category | RF Inductor - Ceramic Wire Wound Chip Inductor | Inductance (µH) | 0.0082 |
| Part Number | SWI1008CT8N2 | Tolerance | ±0.20 nH |
| Grade | General | RDC (Ω) | 0.06 |
| Length (mm) | 2.6 | IDC (A) | 1 |
| Width (mm) | 2.1 | Operating temp.°C (LOW) | -40 |
| Height (mm) | 1.7 | Operating temp.°C (HIGH) | 125 |
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RF Ceramic Wire Wound Chip Inductor SWI1008CT Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you achieve superior RF performance with tight tolerance inductors that meet demanding communication specifications?
ABC ATEC's 8.2nH RF ceramic wire wound chip inductor delivers exceptional Q factor and self-resonant frequency with ±0.2nH tolerance, ensuring reliable performance across cellular, Bluetooth, and broadband applications. Our IATF16949 certified manufacturing process guarantees consistent quality and precision for your RF circuit designs. Contact our engineering team to discuss customized inductor solutions that optimize your communication equipment performance.
Engineered with ABC ATEC's 45 years of specialized expertise in inductor design and manufacturing, this ceramic wire wound solution represents our commitment to quality excellence backed by IATF16949 certification. The compact 1008 package dimension (2.6mm × 2.1mm × 1.7mm) with minimal DC resistance of 0.06Ω provides optimal integration into space-constrained RF circuits. Whether designing next-generation cellular systems, high-speed data transmission networks, or wireless communication modules, our RF ceramic wire wound chip inductor delivers the precision and performance required for mission-critical applications.