18nH, 170mA, 0603 RF Inductor, Multilayer Chip Inductor
MH060318NJS
Multilayer Chip Inductor, General Grade
18nH, 170mA, 0603 Multilayer Chip Inductor MH series are compact, low-profile components with high self resonant frequency (SRF) and ceramic body can withstand operating temperature from -55°C to +125°C. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.
Product Features
- Multilayer structure
- Operating temp.: -55°C ~ +125°C (including self-temperature rise)
Product Applications
- Smart phones, personal devices
- High frequency circuits
| Product Category | RF Inductor - Multilayer Chip Inductor | Inductance (µH) | 0.018 |
| Part Number | MH060318NJS | Tolerance | ±5% |
| Grade | General | RDC (Ω) | 0.81 |
| Length (mm) | 0.6 | IDC (A) | 0.17 |
| Width (mm) | 0.3 | Operating temp.°C (LOW) | -55 |
| Height (mm) | 0.3 | Operating temp.°C (HIGH) | 125 |
- Download
Multilayer Chip Inductor MH0603 Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you reduce PCB footprint while maintaining RF signal integrity in next-generation smartphone designs?
ABC ATEC's 18nH multilayer chip inductor in 0603 size delivers high self-resonant frequency performance in an ultra-compact package, enabling you to maximize PCB real estate for other critical components. With proven reliability across -55°C to +125°C operating range and IATF16949 certification, this inductor ensures consistent performance across your entire smartphone production line. Contact our technical team to discuss volume pricing and customization options for your next product generation.
ABC ATEC's 45 years of specialized inductor manufacturing expertise ensures this component meets the highest quality standards with IATF16949 certification. The MH060318NJS features a DC resistance of 0.81Ω and rated current capacity of 170mA with ±5% inductance tolerance, delivering consistent performance in production environments. This multilayer chip inductor represents our commitment to providing customized, precision-engineered solutions that enable OEM manufacturers and design engineers to optimize circuit performance while maintaining compact PCB layouts and thermal efficiency in next-generation consumer electronics.




