2.4nH RF Inductor 0603 | ABC ATEC Multilayer Chip
ABC ATEC's 2.4nH 0603 multilayer chip RF inductor features high SRF and ceramic construction for smartphones and high-frequency circuits.
2.4nH, 350mA, 0603 RF Inductor, Multilayer Chip Inductor
MH06032N4DS
Multilayer Chip Inductor, General Grade
2.4nH, 350mA, 0603 Multilayer Chip Inductor MH series are compact, low-profile components with high self resonant frequency (SRF) and ceramic body can withstand operating temperature from -55°C to +125°C. They are well-suited for use in Smart phones, personal devices, high frequency circuits applications.
Product Features
- Multilayer structure
- Operating temp.: -55°C ~ +125°C (including self-temperature rise)
Product Applications
- Smart phones, personal devices
- High frequency circuits
| Product Category | RF Inductor - Multilayer Chip Inductor | Inductance (µH) | 0.0024 |
| Part Number | MH06032N4DS | Tolerance | ±0.3nH |
| Grade | General | RDC (Ω) | 0.2 |
| Length (mm) | 0.6 | IDC (A) | 0.35 |
| Width (mm) | 0.3 | Operating temp.°C (LOW) | -55 |
| Height (mm) | 0.3 | Operating temp.°C (HIGH) | 125 |
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Multilayer Chip Inductor MH0603 Series Datasheet
Include dimensions, electrical characteristics and curve diagrams for your reference
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How can you ensure RF component reliability in compact smartphone designs while maintaining signal integrity across extreme operating conditions?
ABC ATEC's MH06032N4DS multilayer chip RF inductor is specifically engineered for smartphone applications with proven high self-resonant frequency performance and ceramic body construction that withstands -55°C to +125°C operating temperatures. Our 45 years of inductor manufacturing expertise and IATF16949 certification guarantee the quality and consistency your smartphone production demands. Request a technical consultation to explore how our RF inductors can optimize your RF front-end module designs.
ABC ATEC's multilayer chip inductor technology delivers the precision and reliability that smartphone manufacturers, personal device producers, and high-frequency circuit designers demand. The MH series' advanced multilayer structure provides superior performance in compact packages, reducing PCB real estate while maintaining critical RF performance parameters. Whether integrating into smartphone RF front-end modules, personal device communication circuits, or high-frequency signal processing applications, this 0603 multilayer chip inductor offers the performance consistency and manufacturing excellence that distinguishes ABC ATEC as a trusted electronics component partner. Contact our technical team today to discuss customization options and volume pricing for your specific high-frequency circuit requirements.